Innovation at Anywaves

Our teams bring together RF and antenna engineers, electronics and DSP specialists, mechanical and thermal experts, and software developers, all working collaboratively from the very start of a project rather than through a sequential handoff. This integrated approach allows critical trade‑offs between electrical performance, thermal behaviour, and mechanical constraints to be resolved early, when design choices are still flexible

A clear example is our digital‑first approach to RF architectures. By leveraging high‑speed ADCs and DACs, we implement reusable, wideband analogue front‑ends combined with digital signal processing in an end‑to‑end optimised system. This results in compact, configurable RF chains with high‑quality performance, while simplifying integration and long‑term evolution for our customers.

 We also develop MMIC packaging in-house: integrating bare die Monolithic Microwave Integrated Circuits into ceramic housings. While this is a demanding process, it gives us direct control over performance, thermal behaviour, and form factor. As a result, we produce components better adapted to space platform constraints than standard catalogue solutions. Every design also goes through multiple iterations and multi-physics simulations before production.

Our Luxembourg facility operates as a fully integrated, in-house development centre, covering PCB fabrication, component assembly, and test. Semi‑automated assembly lines and controlled manufacturing processes ensure repeatability, traceability, and consistent quality from engineering models to flight hardware.

Keeping the full manufacturing chain in‑house allows tight control over workmanship standards, quality assurance, and configuration management. Manufacturing and quality teams work directly with design engineers, enabling early detection of issues and smooth transition from prototype to production.

In parallel, our RF manufacturing capabilities allow rapid prototyping of high‑frequency designs. Using an LPKF® precision laser micro-machining system, we can produce representative RF circuit prototypes in hours rather than weeks, with performance up to 40 GHz, multi-layer PCB capability up to 8 layers, and galvanic through-hole plating. We work with advanced substrate and dielectric materials suited to high-frequency, space-qualified applications. What we validate in the lab accurately reflects in-space behaviour, shortening design cycles and reducing qualification risks.

Radiation is one of the factors that most clearly differentiates space hardware from terrestrial electronics: an incorrect assessment can lead to irreversible failures once the system is in orbit. Our approach is to characterise components at bare-die level and design radiation tolerance directly into the circuit, rather than relying solely on purchasing pre-qualified parts.

We perform radiation testing using heavy-ion beamlines at GANIL in France, the UCL cyclotron in Belgium, and GSI in Germany. This provides results far more representative of the space environment than proton-only testing. Total Ionising Dose (TID) is conducted at ESA’s ESTEC facility.

By conducting these activities in-house, we retain full control over availability, test strategy and data interpretation. The radiation assurance we provide is therefore grounded in our detailed understanding of how components behave across different mission profiles, rather than compliance with generic qualification levels.

Beyond radiation, every product undergoes vibration, shock, and thermal-cycling qualificationto ensure robustness throughout launch and operational life.

Final qualification and compliance tests are completed. Results are reviewed against the original requirements. The product is cleared for delivery or flight.

Gate: AR (Acceptance Review) — the formal close of the programme cycle.